Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders

@article{citeulike:2767460, abstract = {Abstract\ \ Sn-rich solders have been shown to have superior mechanical properties when compared to the Pb-Sn system. Much work remains to be done in developing these materials for electronic packaging. In this paper, we report on the microstructure and mechanical properties of La-containing Sn-3.9Ag-0.7Cu alloys. The addition of small amounts of La (up to 0.5 wt.\%) to Sn-Ag-Cu refined the microstructure by decreasing the length and spacing of the Sn dendrites and decreased the thickness of the Cu6Sn5 intermetallic layer at the Cu/solder interface. As a result of the change in the microstructure, Sn-Ag-Cu alloys with La additions exhibited a small decrease in ultimate shear strength but significantly higher elongations compared with Sn-Ag-Cu. The influence of LaSn3 intermetallics on microstructural refinement and damage evolution in these novel solders is discussed. Our results have profound implications for improving the mechanical shock resistance of Pb-free solders.}, author = {Dudek, M. and Sidhu, R. and Chawla, N. and Renavikar, M. }, citeulike-article-id = {2767460}, journal = {Journal of Electronic Materials}, month = {December}, number = {12}, pages = {2088--2097}, posted-at = {2008-05-07 22:44:44}, priority = {2}, title = {Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders}, url = {http://dx.doi.org/10.1007/s11664-006-0318-3}, volume = {35}, year = {2006} }

TY - JOUR ID - citeulike:2767460 L3 - citeulike-article-id:2767460 TI - Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders JF - Journal of Electronic Materials VL - 35 IS - 12 SP - 2088 EP - 2097 N2 - Abstract  Sn-rich solders have been shown to have superior mechanical properties when compared to the Pb-Sn system. Much work remains to be done in developing these materials for electronic packaging. In this paper, we report on the microstructure and mechanical properties of La-containing Sn-3.9Ag-0.7Cu alloys. The addition of small amounts of La (up to 0.5 wt.%) to Sn-Ag-Cu refined the microstructure by decreasing the length and spacing of the Sn dendrites and decreased the thickness of the Cu6Sn5 intermetallic layer at the Cu/solder interface. As a result of the change in the microstructure, Sn-Ag-Cu alloys with La additions exhibited a small decrease in ultimate shear strength but significantly higher elongations compared with Sn-Ag-Cu. The influence of LaSn3 intermetallics on microstructural refinement and damage evolution in these novel solders is discussed. Our results have profound implications for improving the mechanical shock resistance of Pb-free solders. AU - Dudek, M AU - Sidhu, R AU - Chawla, N AU - Renavikar, M PY - 2006/12/26/ UR - http://dx.doi.org/10.1007/s11664-006-0318-3 ER -